| 发明名称 |
Seed layer |
| 摘要 |
Disclosed are methods for repairing or enhancing discontinuous metal seed layers prior to subsequent metallization during the manufacture of electronic devices. Such repair methods do not require the use of a second electroplating bath.
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| 申请公布号 |
US2002084193(A1) |
申请公布日期 |
2002.07.04 |
| 申请号 |
US20010981851 |
申请日期 |
2001.10.17 |
| 申请人 |
SHIPLEY COMPANY, L.L.C. |
发明人 |
MERRICKS DAVID;MORRISSEY DENIS;BAYES MARTIN W.;LEFEBVRE MARK;SHELNUT JAMES G.;STORJOHANN DONALD E. |
| 分类号 |
C23C18/28;C25D3/38;C25D5/54;C25D7/12;H01L21/288;H01L21/768;(IPC1-7):C25D5/34 |
主分类号 |
C23C18/28 |
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代理人 |
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