| 摘要 |
The present invention provides exemplary methods, systems and apparatus that provide improved substrate characteristics. The present invention may be used in conjunction with or after grinding operations prior to circuit device formation, or alternatively in conjunction with CMP operations on a device wafer between device process steps. In one embodiment, an apparatus (100) for processing a substrate (118) includes a rotatable first spindle (110) having a grind pattern coupled thereto for grinding the substrate. The first spindle is further adapted to receive a polishing pad (200). The apparatus includes a second spindle (116) adapted to hold the substrate, and a gimbal device (150) coupled to the first spindle and adapted to provide three axis movement thereof. In this manner, the same apparatus may be used for both grinding and polishing of a wafer.
|
