| 摘要 |
<p>A Cu film serving as the non-magnetic layer of a spin valve film is formed on a substrate in a sputter film forming chamber in which a film is formed by sputtering under a reduced pressure, a substrate is exposed to a gas atmosphere in a gas exposing chamber into which gas activating the surface of the Cu film is introduced, and the substrate is moved again to the sputter film forming chamber to form the remaining portion of the spin valve film.</p> |
