| 摘要 |
<p>An EMI shield system for containing EMI emissions in electronic devices includes a thermo-formable shield component (26) maintained in contact with a ground trace (46) on a printed-circuit board (32). A rib system (11) integral with an injection-molded housing component (10) forces the thermo-formed shield component against the ground trace (46). An elastomeric gasket (25) between the rib system (11) and the thermo-formed component insures a firm, compliant seal against the ground trace.</p> |
