发明名称 |
Multi-row lead frame |
摘要 |
A lead frame ( 10 ) for a semiconductor device includes a first row of terminals ( 12 ) surrounding a die receiving area ( 14 ) and a second row of terminals ( 16 ) spaced from and surrounding the first row of terminals ( 12 ). The first and second rows of terminals ( 12, 16 ) have a first height (H<SUB>1</SUB>). The terminals ( 12 ) of the first row include a step ( 26 ) that has a greater height (H<SUB>2</SUB>). Bond wires ( 36 ) connecting die pads ( 34 ) to the first row terminals ( 12 ) extend over the second height H<SUB>2 </SUB>part of the terminal ( 12 ) and are attached to the first height H<SUB>1 </SUB>part of the terminal ( 12 ). The step ( 26 ) insures that the bond wires ( 36 ) attached to the stepped terminals ( 12 ) have a high wire kink profile so that they are less susceptible to damage in later process steps.
|
申请公布号 |
US7301225(B2) |
申请公布日期 |
2007.11.27 |
申请号 |
US20060364047 |
申请日期 |
2006.02.28 |
申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
WONG FEI YING;HO WAI KEUNG;WONG HO WANG |
分类号 |
H01L23/495;H01L21/00;H01L21/66 |
主分类号 |
H01L23/495 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|