| 发明名称 |
Adhesive resin compositions and method for separating adherends bonded together by the composition |
| 摘要 |
<p>The present invention relates to an adhesive resin composition comprising a heat-generating material (A) which generates heat when subjected to high frequency induction and a thermoplastic resin (B) modified with a monomer having a functional group which reacts with an inorganic, the thermoplastic resin (B) having a melting point ranging from 90 DEG C to 200 DEG C. The present invention also relates to a method for separating a bonded article into adherends, the method comprising detaching by induction heating the bonded portions of adherends bonded together by the thermoplastic resin composition comprising a heat-generating material (A) which generates heat when subjected to high frequency induction and a thermoplastic resin (B) modified with a monomer having a functional group which reacts with an inorganic substance and has a melting point ranging from 90 DEG C to 200 DEG C.</p> |
| 申请公布号 |
EP1191079(A3) |
申请公布日期 |
2002.07.03 |
| 申请号 |
EP20010122578 |
申请日期 |
2001.09.25 |
| 申请人 |
TOYO BOSEKI KABUSHIKI KAISHA |
发明人 |
YOSHIHARA, NORI;OHAMA, KENJI;SAKAI, SATOSHI;KOSUGI, HITOSHI;NAKANISHI, KOJI |
| 分类号 |
C09J5/06;C09J11/04;(IPC1-7):C09J9/00;B29C65/72;C09J11/02;B29C65/36 |
主分类号 |
C09J5/06 |
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