Glass for encapsulating semiconductor and overcoat tube for encapsulating semiconductor using the same

摘要

The present invention provides a glass for encapsulating a semiconductor comprising: SiO2 in an amount of from 20 to 50% by weight; Al2O3 in an amount of from 1 to 12% by weight; B2O3 in an amount of from 6 to 25% by weight; PbO in an amount of from 30 to 55% by weight; Cs2O in an amount of from 0.5 to 12% by weight; and Li2O, Na2O and K2O in a total amount of lower than 90 ppm, each based on the total weight of the glass.