| 发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR CARRIER FILM |
| 摘要 |
PURPOSE: To provide a method for manufacturing a semiconductor carrier film, by which a circuit board having fine-pitch patterns can be produced and the semiconductor carrier film with high reliability and low cost can be produced. CONSTITUTION: The method for manufacturing the semiconductor carrier film, where a substrate made of a copper foil of 12 μm or more in thickness and a polyamide-based film is used, and the copper foil is etched to a thickness of 5 to 9 μm.
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| 申请公布号 |
KR20020052225(A) |
申请公布日期 |
2002.07.03 |
| 申请号 |
KR20010054419 |
申请日期 |
2001.09.05 |
| 申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
KATAOKA TATSUO;OZAWA IKUHIRO |
| 分类号 |
H01L21/60;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
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