发明名称 Polishing apparatus
摘要 A polishing apparatus can produce a uniform quality of polished products by supplying a polishing solution consistently without being affected by any disturbances in the solution supply source. The polishing apparatus comprises: a polishing section for polishing a workpiece by pressing the same against a polishing tool; a solution piping assembly to be connected to an external solution supply device for transferring a polishing solution therefrom to the polishing section; and a solution suction device provided in the solution piping assembly for introducing the polishing solution from the solution supply device to the polishing section at a desired flow rate.
申请公布号 US6413154(B1) 申请公布日期 2002.07.02
申请号 US20000582845 申请日期 2000.09.11
申请人 EBARA CORPORATION;KABUSHIKI KAISHA TOSHIBA 发明人 TOGAWA TETSUJI;SAKURAI TAKESHI;TAKADA NOBUYUKI;KODAMA SHOICHI;YAJIMA HIROMI
分类号 B24B37/00;B24B37/04;B24B55/03;B24B57/02;H01L21/304;(IPC1-7):B24B29/00 主分类号 B24B37/00
代理机构 代理人
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