发明名称 |
Polishing apparatus |
摘要 |
A polishing apparatus can produce a uniform quality of polished products by supplying a polishing solution consistently without being affected by any disturbances in the solution supply source. The polishing apparatus comprises: a polishing section for polishing a workpiece by pressing the same against a polishing tool; a solution piping assembly to be connected to an external solution supply device for transferring a polishing solution therefrom to the polishing section; and a solution suction device provided in the solution piping assembly for introducing the polishing solution from the solution supply device to the polishing section at a desired flow rate.
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申请公布号 |
US6413154(B1) |
申请公布日期 |
2002.07.02 |
申请号 |
US20000582845 |
申请日期 |
2000.09.11 |
申请人 |
EBARA CORPORATION;KABUSHIKI KAISHA TOSHIBA |
发明人 |
TOGAWA TETSUJI;SAKURAI TAKESHI;TAKADA NOBUYUKI;KODAMA SHOICHI;YAJIMA HIROMI |
分类号 |
B24B37/00;B24B37/04;B24B55/03;B24B57/02;H01L21/304;(IPC1-7):B24B29/00 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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