Process of removing CMP scratches by BPSG reflow and integrated circuit chip formed thereby

摘要

A method for removing scratches from a dielectric layer comprising the steps of: providing a layer of a reflowable dielectric material; and heating the dielectric layer to a temperature sufficient to cause the reflowable dielectric material to reflow is provided. This method provides a manner to remove the scratches created during the chemical mechanical polish steps, which can later become filled with metallization, causing shorts in the circuitry and subsequent integrated circuit chip failure.