发明名称 Semiconductor device including a chip having high-frequency circuit blocks
摘要 A semiconductor device includes a high-frequency-use semiconductor chip having high frequency circuit blocks. The semiconductor chip is mounted on a circuit substrate and electrical connectors are provided for electrically connecting each one of the high frequency circuit blocks in the semiconductor chip to the circuit substrate. The electrical connectors situated adjacent to each other are provided such that the distance between first contacts at which the electrical connectors are electrically connected to the respective high frequency circuit blocks is smaller than the distance between second contacts at which the electrical connectors are electrically connected to the circuit substrate.
申请公布号 US6414387(B1) 申请公布日期 2002.07.02
申请号 US20000571659 申请日期 2000.05.15
申请人 SHARP KABUSHIKI KAISHA 发明人 HARA SHINJI;ASANO HIROYUKI
分类号 H01L23/12;H01L21/60;H01L23/48;H01L23/50;H01L23/66;H01L25/04;H01L25/18;(IPC1-7):H01L23/52 主分类号 H01L23/12
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