STACKED SEMICONDUCTOR DEVICE PACKAGE

摘要

A stacked semiconductor device package is provided to be stronger with respect to physical impact applied from the outside by including an interposer on which semiconductor device packages having mutual mirror effect are mounted by a land grid array method. An interposer(170) having first and second surfaces are formed between first and second semiconductor device packages. The first and second semiconductor device packages are mounted on the first and second surfaces of the interposer by a land grid array method wherein the first and second semiconductor devices packages are mirror structures to each other or become a mutual mirror structure by the interposer. The first and second semiconductor device packages can be connected to a system board(200) by using the interposer as a medium.