| 摘要 |
The polyamide resin composition of the present invention comprises 100 parts by weight of a polyamide resin (A) having dicarboxylic acid units (a) comprising from 60 to 100 mol % of terephthalic acid repeat units and diamine units (b) comprising from 60 to 100 mol % of C6-18 aliphatic alkylenediamine repeat units, and from 1 to 100 parts by weight of a polybromostyrene (B), comprising from 0.5 to 100% by weight of a polybromostyrene having an epoxy group. Molded articles prepared from the polyamide resin composition of the present invention have good flame retardancy, good chemical resistance, good surface appearance and good blistering resistance.
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