发明名称 Glass ceramic board
摘要 A glass ceramic multilayer circuit board uses Ag as a conductive material, in which oxidation and diffusion of silver are suppressed. The glass ceramic multilayer circuit board is formed by stacking glass ceramic layers and conductor layers, and then simultaneously burning the layered product. The glass ceramic layers are made of a glass ceramic insulating material which is composed of a glass component and a ceramic component, and to which a metal powder of Cu, Ni or the like is added.
申请公布号 US6414247(B1) 申请公布日期 2002.07.02
申请号 US19990443230 申请日期 1999.11.18
申请人 MURATA MANUFACTURING CO., LTD. 发明人 NAKAI HIDEAKI;SUNAHARA HIROFUMI;SAKAMOTO SADAAKI
分类号 C03C10/02;C03C14/00;C03C17/06;C04B37/02;H05K1/03;H05K1/09;H05K3/46;(IPC1-7):H05K1/09 主分类号 C03C10/02
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