发明名称 |
Method of detecting and monitoring stresses in a semiconductor wafer |
摘要 |
A method of detecting and monitoring elastic strains in a semiconductor wafer (12) comprising the steps of coupling the wafer (12) to a transducer (10) having a periphery (11). This is followed by operating the transducer (10) to produce ultrasonic vibrations at a predetermined wavelength lambd and propagating a standing wave through the wafer (12) in response to the ultrasonic vibrations. The method is characterized by extending the wafer (12) in a cantilevered section L from the periphery (11) of the transducer (10) to a distal end (13), and measuring the amplitude of the standing wave lambd in the cantilevered section L. For maximum efficiency, the cantilevered section L is substantially one quarter of the predetermined wavelength (lambd/4).
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申请公布号 |
US6413789(B2) |
申请公布日期 |
2002.07.02 |
申请号 |
US20010767980 |
申请日期 |
2001.01.23 |
申请人 |
UNIVERSITY OF SOUTH FLORIDA |
发明人 |
OSTAPENKO SERGEI |
分类号 |
H01L21/00;H01L21/66;(IPC1-7):H01L21/66 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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地址 |
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