| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing machine wherein slurry grinding fluid can be effectively collected in polishing an edge portion of a circular substrate and wherein repair, inspection and the like can be safely conducted. SOLUTION: A drum 120 of the polishing machine 100 includes a polishing member 122 which has a grinding face 122A of a near conical shape in its inner face, and the grinding member 122 is rotatably mounted around a rotary shaft 120R. The polishing machine 100 is equipped with a chuck table 131 which retains a semiconductor wafer 10 while causing it to turn, and with a pushing cylinder 170 which causes the chuck table 131 to move so that an edge portion 11 of the semiconductor wafer 10 be brought into contact with the grinding face 112A at a predetermined angle ofθ2.
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