| 摘要 |
The present invention includes a method of forming a capacitor on a semiconductor support wafer. The method comprises forming a diffusion area in the support wafer to provide a first electrode and a second electrode of the capacitor, implanting a first gas in the diffusion area to form a dielectric layer at a predetermined depth, wherein a first region of the diffusion area is formed below the dielectric layer as the first electrode of the capacitor and a second region of the diffusion area is formed above the dielectric layer as the second electrode of the capacitor, etching a trench in the support wafer to isolate laterally the dielectric layer, growing an epitaxial layer, and implanting a second gas to isolate the epitaxial layer from the second electrode. The capacitor is formed substantially subjacent a semiconductor device formed in the epitaxial layer.
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