| 摘要 |
The present invention relates to a tape for semiconductor package used to attach a chip and a lead frame or a chip and a substrate, method of manufacturing the same, and method of manufacturing the package using the tape. The tape of the present invention is manufactured by applying a release film at one side of a base film having a sheet type or a roll type, forming a plurality of alignment holes, at a given distance, along the edge of the base film by means of punching or etching process, for exact position alignment, and forming a thermoplastic pattern on the release film so that it can match to a lead frame or the portion to which a chip of a substrate is attached, by means of screen printing process using a mask. Also, the tape of the present invention can be used in manufacturing all the packages such as a package for attaching the chip to the lead frame as the package of a lead on chip (LOC) type, and the package for attaching the chip to the substrate as the chip scale package (CSP), etc. and can attach the thermoplastic pattern formed at the tape to a desired portion of a plurality of lead frames or a plurality of substrates simultaneously, by means of thermal press process. Thus, it can simplify the process of manufacturing the package, reduce the cost and improve the productivity.
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