发明名称 Method of creating photonic via
摘要 A photonic via is made in a substrate by making a hole in the substrate, heating the substrate, and inserting a fiber optic into the hole. In one embodiment, a lens can be made by applying a polymer on top of the photonic via and curing.
申请公布号 AU2703602(A) 申请公布日期 2002.07.01
申请号 AU20020027036 申请日期 2001.11.15
申请人 INTEL CORPORATION 发明人 VENKATESAN MURALI
分类号 G02B6/26;C03C15/00;G02B6/122;G02B6/42;G02B6/43 主分类号 G02B6/26
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