发明名称 Capacitor with extended surface lands and method of fabrication therefor
摘要 A capacitor (FIGS. 6-9) includes one or more extended surface lands (604, 704, 804, 904, FIGS. 6-9). In one embodiment, each extended surface land is a land on a top or bottom surface of the capacitor, having a land length that is equal to at least 30% of the width (614, FIG. 6) of the capacitor or 20% of the length (914, FIG. 9) of the capacitor. When embedded within an integrated circuit package (1102, FIG. 11), two or more vias (1112) can be electrically connected to the extended surface lands (1108).
申请公布号 AU1795402(A) 申请公布日期 2002.07.01
申请号 AU20020017954 申请日期 2001.11.27
申请人 INTEL CORPORATION 发明人 DAVID FIGUEROA;MICHAEL J. WALK;JORGE P. RODRIGUEZ;HUONG DO
分类号 H01G4/252;H01G;H01G2/00;H01G2/06;H01G2/20;H01G4/228;H01L23/52 主分类号 H01G4/252
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