发明名称 METHOD FOR MANUFACTURING RIGID-FLEX PRINTED WIRING BOARD
摘要 A method for manufacturing a rigid-flexible printed wiring board is provided to obtain stable peeling strength by performing washing with calcium added water after an alkali-treatment. A method for manufacturing a rigid-flexible printed wiring board includes the steps of: treating both outer surfaces of an inner layer FPC(Flexible Printed Circuit)(30) with alkali; and respectively stacking outer layer RPCs(Rigid Printed Circuits)(50A,50B) on the both outer surfaces of the inner layer FPC through adhesive members(40A,40B). The method for manufacturing the rigid-flexible printed wiring board further includes the step of: washing the both surfaces of the alkali-treated inner layer FPC with calcium added water between the two steps.
申请公布号 KR20080081142(A) 申请公布日期 2008.09.08
申请号 KR20080083506 申请日期 2008.08.26
申请人 FUJIKURA LTD. 发明人 AIZAWA FUMITAKA;TAKAHASHI KATSUHIKO;TSURUSAKI KOJI
分类号 H05K3/46 主分类号 H05K3/46
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