APPARATUS FOR FABRICATING ELECTRONIC PRINTED CIRCUIT BOARD

摘要

PURPOSE: An apparatus for fabricating an electronic printed circuit board is provided to remove an oxide layer or organic materials or carbon from a surface of a metal layer by using a simple method without complex processes. CONSTITUTION: A metallized layer(2) is formed on an upper surface of a ceramic substrate(1). The metallized layer(2) is formed with a titanium layer or a nickel layer or a nickel alloy layer. A solder layer(3a) is formed on an upper surface of the metallized layer(2) formed on the upper surface of the ceramic substrate(1). An oxide(4) is grown on the solder layer(3a). A laser beam(5) is irradiated on a solder bump instead of the solder layer(3a) through a lens(6) and a mirror. The oxide(4) is removed from the solder layer(3a) by irradiating the laser beam(5) on the upper surface of the solder layer(3a).