| 摘要 |
PURPOSE: A probe card is provided to increase the number of tested semiconductor devices by improving a structure. CONSTITUTION: A probe card comprises holes(3) formed in center portions, a plurality of contact pads(5) connected to pogo pins, needles(4) fixed around the holes(3), and a PCB(Printed Circuit Board)(2) connected with the contact pads(5). At this point, the needles(4) are respectively connected with the contact pads(5). Because of forming a pair of holes(3), the needles(4) formed around the holes(3) have a double number, so that the contact pads(5) respectively connected with the needles(4) are double, thereby increasing the number of tested semiconductor devices when performing an electrical test of a wafer.
|
