| 摘要 |
PROBLEM TO BE SOLVED: To provide a microwave circuit which firmly bonds a microwave device to improve the reliability without causing abnormal oscillations. SOLUTION: The microwave circuit 1 has lands 9a, 9b connected to a ground pattern 4 via through-holes 10a, 10b on the surface of a board 2 and a microwave device 5 soldered to the lands 9a, 9b, and the ground pattern 4 is formed on the backside of the board 2. The through-holes 10a, 10b are formed in the lands 9a, 9b and filled with a conductive paste 11. |
