发明名称 SEMICONDUCTOR ELEMENT HOUSING PACKAGE
摘要 PROBLEM TO BE SOLVED: To solve the problem that a resonance ascribed to the width of a flat plate of an input/output terminal influences transmission characteristics of high frequency signals to result in that no desired high frequency transmission characteristics could be obtained, and a deformation of a semiconductor package being screwed to an outer electric circuit board, etc., is directly exerted to the input/output terminal to cause cracks in the flat plate. SOLUTION: An input/output terminal 3 is composed of a flat plate 6 of an approximately square dielectric having a line conductor 7 formed from one side to the opposite side on the upside and a vertical dielectric wall 89 bonded to the upside of the flat plate 6 through the line conductor 7. Both sides and the downside parallel to the line conductor 7 of the flat plate 6 are fitted in a groove 4a formed into the upside of a metal base 4. Thus, the terminal 3 is fitted and mounted on the metal base 4 and fitted to a mounting part 9 together with the base 4.
申请公布号 JP2002184889(A) 申请公布日期 2002.06.28
申请号 JP20000378937 申请日期 2000.12.13
申请人 KYOCERA CORP 发明人 KATO HIDETAKA
分类号 H01L23/12;H01L23/02;H01P3/02 主分类号 H01L23/12
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