| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultra-thin film package by which the total thickness after packaging can be considerably reduced and the operating efficiency in the applying process can be improved. SOLUTION: With respect to a polymer film substrate, a PI substrate or an application of a PI die carrier, the method for bonding a die 2 is changed from the wire bonding technique to the flip chip bonding technique. When an electrical bonding is performed, the total thickness of the package can be further reduced by reversing the die 2 and previously bonding its I/O pins to depressed legs 12 which are provided in a polymer film, a die carrier of polyimide or a substrate. |
