SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING IT

摘要

PROBLEM TO BE SOLVED: To enable to efficiently discharge the moisture from a semiconductor device to the outside at the time of reflow when the semiconductor device is mounted on another implemented board. SOLUTION: A semiconductor chip 1 is mounted on a circuit board 2 through an adhesive resin layer 3, and moisture discharging openings 7 are formed in the circuit board 2. Depressions 8 having a width of opening larger than the diameter of opening of the moisture discharging openings 7 are formed in parts of the adhesion resin layer 3 exposed in the moisture discharging openings 7 on the adhesive resin layer 3.