MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To improve reliability of connecting a semiconductor device to a mounting board by alleviating a stress operating at a connecting terminal when the device is laminated and mounted on the mounting board. SOLUTION: A mounting structure of the semiconductor device comprises a semiconductor element 11 mounted on one surface of a board 15; and a plurality of semiconductor devices 10 each having a connecting terminal 14 formed in a bump-like state on the one surface side of the board 15, and laminated in multilayer in a vertical direction so that the adjacent devices 10 are electrically connected via the terminal 14. In this case, the terminals 14 of the adjacent devices 10 are disposed to be superposed with each other and disposed so that the flat surface disposition of the terminal 14 of the adjacent devices 10 are disposed to be deviated from each other.