| 摘要 |
PROBLEM TO BE SOLVED: To provide the packaging structure of a semiconductor device that can secure reliability after packaging, and to provide the semiconductor device. SOLUTION: In this packaging structure of the semiconductor device, the semiconductor device is packaged onto a substrate 1, where the semiconductor device has a semiconductor element 2' having an electrode formation surface where a bump 3 for external connection is formed. In this case, the semiconductor element 2' is thinned to 200 to 10 μm, and flexural stiffness is reduced for easily bending. In a packaging state where the bump 3 is joined to a circuit electrode 1a on the substrate 1, the semiconductor element 2' is subjected to out-of-plane deflection deformation at a portion to the bump 3 according to the shrinkage displacement of the substrate 1, thus allowing displacement in the surface direction of the semiconductor element 2' of the bump 3, relieving stress generated by shrinkage in the substrate 1 at the junction section between the bump 3 and circuit electrode 1a, and hence securing reliability after the packaging. |
