| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip-part type LED having strong structure to external thermal stress. SOLUTION: This chip-part type LED has first and second lead frames, an LED element mounted onto the first lead frame and electrically connected to the first and second lead frames, and a cylindrical container that retains the first and second lead frames and at the same time accommodates the LED element inside. The LED element is positioned between the upper- and lower-end openings of the container, the inner-wall surface of the container is formed, so that the emission light of the LED element is reflected to the side of the upper-end opening, and the container is filled with a translucent resin from the upper- to lower-end opening. |
