| 摘要 |
PROBLEM TO BE SOLVED: To provide the method of manufacturing semiconductor device for ideally preventing a resin from leaking by a heat-resistance adhesive tape in a sealing process, and at the same time for preventing the affixed tape from easily obstructing in a series of processes. SOLUTION: This manufacturing method includes at least a mounting process for bonding a semiconductor chip 15 onto a die pad 11c of a metallic lead frame 10 where the heat-resistance adhesive tape 20 is affixed, a connection process for electrically connecting the tip of a terminal section 11b in the lead frame 10 to an electrode pad 15a by a bonding wire 16, a sealing process for sealing one side of the sides of a semiconductor chip by a sealing resin 17, and a cutting process for cutting a sealed structure 21 into an individual semiconductor device 21a. In this case, the heat-resistance adhesive tape 20 is composed of a base layer having a line thermal coefficient of expansion of 1.0×10-5 to 3.0×10-5/K at 50 to 250 deg.C, and an adhesive mass layer having a thickness of 10 μm or less. |
