| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the manufacturing costs and to improve the manufacturing efficiency with respect to a method for manufacturing semiconductor device and semiconductor devices having rewiring. SOLUTION: With respect to the method for manufacturing semiconductor devices having a wire forming step for forming a wire for connecting an electrode pad 15 and a solder ball 14 (mounting terminal) on a wafer 40 on which the electrode pad 15 is formed, the wire forming step is provided with a step for placing copper foil 25 on the wafer 40 by using adhesive 18, a step for patterning the copper foil 15 into a specified wiring pattern, and a step for electrically connecting the patterned copper foil 25 and the electrode pad 15.</p> |
