发明名称 APPARATUS FOR GRASPING WAFER
摘要 <p>PROBLEM TO BE SOLVED: To provide an apparatus for grasping a wafer in which grasping of a wafer can be confirmed using a single detecting means. SOLUTION: The apparatus for grasping a wafer comprises a drive means 2 having a presser 8 advancing retractably in the longitudinal direction, and means 9 for detecting advance/retract of the pressor 8. When the detecting means 9 detects the pressor 8 advanced up to a specified position and stopped thereat, a decision is made that a wafer is grasped normally. When the detecting means 9 detects the pressor 8 advanced over the specified position, a decision is made that no wafer is present on the apparatus for grasping a wafer.</p>
申请公布号 JP2002184853(A) 申请公布日期 2002.06.28
申请号 JP20000382718 申请日期 2000.12.15
申请人 YASKAWA ELECTRIC CORP 发明人 ASANO HIROSHI
分类号 B25J15/08;B65G49/07;H01L21/00;H01L21/677;H01L21/68;H01L21/687;(IPC1-7):H01L21/68 主分类号 B25J15/08
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