| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which maintains the bonding positions of semiconductor chips with high precision, reduces proper thickness of solder and voids in the semiconductor, and can have the semiconductor chips and other components soldered with high mounting density with a small man- hour in a short process time by a small number of devices when the semiconductor chips and other components are mounted by soldering on one base material. SOLUTION: The semiconductor device has a pad 32 provided on the base material 31 and a semiconductor chip 34, which is rectangular when viewed from above, soldered on the pad 32; and the pad 32 has positioning corner parts 35, meeting the corner parts of the semiconductor chip 34 or slightly spreading outward from them, at the positions of both corner parts of a diagonal of the semiconductor chip 34 and the outer peripheral edge parts of the pad 32 other than those positioning corner parts 35 spread more than the corner parts. |
