发明名称 SOCKET FOR SOLID-STATE IMAGE PICKUP DEVICE INSPECTION
摘要 PROBLEM TO BE SOLVED: To improve the compatibility of a socket for the solid-state image pickup device inspection with difference in a package type of a solid-state image pickup device 12, and to make it unnecessary to prepare different solid- state image pickup devices for respective package types and replace the socket for the solid-state image pickup device inspection when the package type of the solid-state image pickup device for inspection. SOLUTION: This socket for the solid-state image pickup device inspection has a plurality of pins 8 which are arranged so as to be brought into contact partially with respective leads 13 of both side surfaces of a solid-state image pickup device 12, and lead out electrically the respective leads 13 of the solid- state image pickup device 12; and a lever 13 which is operated to separate the plurality of pins 8 brought into contact with the leads 13 arranged, for instance, on both the side surfaces of the solid-state image pickup device 12, from the respective leads 13 of the solid-state image pickup device 12.
申请公布号 JP2002184964(A) 申请公布日期 2002.06.28
申请号 JP20000381765 申请日期 2000.12.15
申请人 SONY CORP 发明人 TAGAMI TAKAYUKI
分类号 H01L27/14;H01L23/32;H01R24/00;H01R33/76;H01R107/00;(IPC1-7):H01L27/14;H01R24/10 主分类号 H01L27/14
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