发明名称 |
COMPOSITE MODULE COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a composite module component to be used in a high-frequency power amplifier, etc., especially to efficiently dissipate heat from a bare chip mounted on the module. SOLUTION: A heat sink is mounted on the back face of a bare chip via an electroconductive resin. Heat is dissipated from a motherboard by implementing a module on the motherboard. |
申请公布号 |
JP2002184931(A) |
申请公布日期 |
2002.06.28 |
申请号 |
JP20010257367 |
申请日期 |
2001.08.28 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
KATOU HISAYOSHI;KUSHITANI HIROSHI;HASHIMOTO KOJI |
分类号 |
H01L25/00;(IPC1-7):H01L25/00 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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