发明名称 FORMING METHOD OF CIRCUIT BOARD HOUSED IN JUNCTION BOX, AND JUNCTION BOX IN WHICH CIRCUIT BOARD IS HOUSED
摘要 <p>PROBLEM TO BE SOLVED: To reduce man-hours for manufacturing circuit boards in layers housed in a junction box. SOLUTION: A plurality of insulating boards, on which rectangular busbars are laid in a parallel with each other, are laid in parallel with each other in the direction perpendicular to the laying direction of the busbars. After the respective busbar laying surfaces are alternately reversed, single conductor wires (bare wires) are successively laid in parallel with each other, and in a single process on the upper surface to the lower surface and on the lower surface to the upper surface, and so forth, of the insulating boards, where the busbars are not laid in the direction perpendicular to the laying direction of the busbar. The laid single-conductor wires are welded to the busbar through apertures drilled in the insulating board at cross points to form a required circuit. Thus a plurality of circuit boards, having the insulation boards with the busbar on the one side surfaces and the single-conductor wires cross-wired on the other side surfaces are formed. The circuit boards are vertically piled, so as to make the busbar and the single-conductor wires face each other.</p>
申请公布号 JP2002186139(A) 申请公布日期 2002.06.28
申请号 JP20000382140 申请日期 2000.12.15
申请人 SUMITOMO WIRING SYST LTD 发明人 KOBAYASHI NORIKO;TSUNODA TATSUYA;SAKA YUJI
分类号 H05K7/06;H02G3/16;(IPC1-7):H02G3/16 主分类号 H05K7/06
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