| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow method for a printed circuit board and a reflow furnace by which the thermal deformation of the printed circuit board can be effectively prevented by shortening a time for normal heating through preheating and defining a heating part at the solder connection part of electronic parts by the normal heating. SOLUTION: In a reflow furnace 1, a printed circuit board 11 on which an electronic part 10 is placed is transferred and heated, and its solder connection part 10a is soldered by heating to mount the electronic part 10. The reflow furnace 1 is provided with a preheating part 3 which is provided in the transfer route 2 of the printed circuit board 11 in order to heat the printed circuit board 11 at such a high temperature as not to give a thermal deformation thereto, and a normal heating part 4 which is provided in the downstream side of the preheating part 3 to locally heat only the solder connection part 10a of the preheated printed circuit board 11 and to solder the solder connection part 10a.
|
