| 摘要 |
PROBLEM TO BE SOLVED: To provide a device that operates on heat release with small space demand, and at the same time absorbs a high-frequency electromagnetic beam to a semiconductor chip to be clocked. SOLUTION: This device comprises a heat transfer material, and a shielding body (3) for at least partially covering the semiconductor chip (1) is arranged between the surface of the semiconductor chip (1) and a cooling element (4) belonging to the semiconductor chip (1). The shielding body (3) is subjected to heat transfer coupling to both the semiconductor chip (1) and cooling element (4), and the shielding body (3) contains ferrite, thus absorbing an electromagnetic interference signal radiated by the clock frequency from the semiconductor chip (1). |
