| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device package which strengthens the noise suppression effect by mounting bypass capacitors, and allows a high density mounting on a printed wiring board. SOLUTION: The semiconductor device package has pads on a mounting surface for connection to other apparatus, and the pads are connected to terminals of an IC bare chip 110. The package comprises bypass capacitor mounting pads 132, 142, 152 and 162 respectively connected through through-holes to pads 130, 140, 150 and 160 being power feeding or grounding terminals on a mounting backside.</p> |
