| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate which can exceedingly suppress the disconnection of wiring caused by the cracking of a solder resist, and to provide a semiconductor package using the substrate. SOLUTION: The substrate has terminals for connecting solder balls. The wiring connected to the terminals has a width of <=100μm, and a solder resist covering the wiring has modulus of elasticity of 2-3 GPa. In the semiconductor package, a semiconductor chip is mounted on the substrate.
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