| 摘要 |
PROBLEM TO BE SOLVED: To provide a power semiconductor device capable of measuring characteristics of respective semiconductor elements by commonly providing a component and a resin case between modules, and preventing a fault such as a stress or the like in association with an increase in a rated current value and having an easy test and maintenance. SOLUTION: In a connecting section of first and second module arrays MA1 and MA2 constituted of four semiconductor device modules 100, a unit frame 221 of a coupling plate constituted of metal is arranged to bridge the first and second module arrays MA1 and MA2 on upper parts of one ends of bottom metal boards 9, and the boards 9 are coupled by the frame 221 to each other. The control board 200 is arranged so as to cover the overall upper surface area of the body of the module 100 for constituting the first and second module arrays MA1 and MA2. |
