| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that the temperature of reading/writing amplification IC rises, reading/writing speed largely drop and the characteristic of a hard disk itself is largely affected since the heat dissipation of reading/writing IC is poor in the hard disk mounting FCA where reading/writing amplification IC is fixed. SOLUTION: A heat dissipating electrode 15 is exposed to the rear face of insulating resin 13, and a metallic board 23 is fixed to the heat dissipating electrode 15. The rear face of the metallic board 23 is positioned on a substantial face with the rear face of a flexible sheet and it can easily be fixed with a second support member 24. Thus, heat generated from the semiconductor element can satisfactorily be discharged through the heat dissipating electrode 15, the metallic board 23 and the second support member 24. |
