| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device which is low-cost, small-sized, low- profile and lightweight and has the effect of heat dissipation and to obtain a method for manufacturing it. SOLUTION: TAB tape is housed in a package. Electrodes of the semiconductor device 1 and inner leads 10 of the TAB tape are connected, and outer leads 11 of the TAB tape and inner leads 3 of a lead frame are connected. Further, the surface other than the surface having the electrodes of the semiconductor device 1 is bonded to a heat sink 8. The part of the heat sink 8 to which the semiconductor device 1 is bonded is provided with a depression 14 having a flat surface larger than the planar dimension of the semiconductor device 1. In this way, the semiconductor device 1 is made even thinner. Accordingly, since the TAB tape is used for connection with the electrodes of the semiconductor device 1, the pitch of electrode of the semiconductor device 1 can be narrowed and the semiconductor device 1 itself can be downsized. Consequently, the effective number of chips from one wafer can be increased in the process step. |
