| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a high quality, high productivity, highly reliable and inexpensive printed circuit board, and its manufacturing method, in which high density build-up can be dealt with and application to electronic apparatus is widened, and to provide a printed circuit board applicable widely to a both sided printed circuit board, a multilayered printed circuit board, a smooth substrate, a build-up substrate, a multilayer substrate with cavity, and the like. SOLUTION: A hole made in an electronic basic material is filled, at a desired part thereof, selectively with paste, containing a substance having the function of an electrical component or an electronic component, thus forming the function of an electrical component or an electronic component three-dimensionally between conductor layers.</p> |
