| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a plastic package which suppresses burr from being produced in cutting a plastic circuit board to form openings. SOLUTION: The method of manufacturing a plastic package 10 by forming openings into portions of a plastic base 12 having conductor wiring patterns 13, corresponding to specified openings formed at desired portions of a solder resist film 15 provided on a plastic circuit board 11, comprises a first step of mounting or pasting a resin film 24 on one surface of the plastic circuit board 11 having openings of the solder resist film 15, and a second step of inserting a cutting blade into the other side of the circuit board 11 to form openings. |
