| 摘要 |
PROBLEM TO BE SOLVED: To provide the heat radiating system of LSI with high heat radiating efficiency. SOLUTION: A substrate 19 where an LSI chip is mounted is provided with a connection area 4 constituted of a metallic pad 14 of a metallic solid area arranged just below the LSI chip generating heat at the time of use, the solid layer 5 of metal which is arranged in at least one of layers constituting the substrate 19, a heat transmission connection means which directly or indirectly connects the connection area 4 with the solid layer 5, and a bonding means 3 connecting the lower part of the LSI chip and the connection area 4. A part of a heating value generated by the LSI chip is transmitted to the solid layer 5 through the heat transmission connection means. Thus, the heating value is removed. The heat radiating system of LSI with high heat radiating efficiency can be obtained. |
