| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board and its manufacturing method by which the interlayer continuity of a conductor pattern can be given by a simple method and a uniform thickness be realized without controlling plating thickness for pattern formation. SOLUTION: This method includes a step to form a conductor pattern 2 which is formed by laminating a metallic plating pattern layer 21 and a metallic layer 22 on the side for forming the metallic layer of a carrier 3 and is provided with a first conductive pad 20, a step to form an insulation resin layer 1 on the surface of the carrier 3, a step to form a via hole 5 in which the first conductive pad is a bottom and to supply a conductive material 50 therein to obtain a laminated board 84, a step to laminate the laminated board 84 on a separate wiring board 83 provided with a second conductive pad 84 and to allow the second conductive pad to be brought into contact with a conductive material, a step to curing the insulation resin layer, and a step to remove the carrier 3. |
