发明名称 METHOD AND DEVICE FOR CORRECTING PROCESS DATA
摘要 PROBLEM TO BE SOLVED: To provide a method and device for correcting process data by which a processing unit is enabled to perform proper deposition by automatically and reasonably correcting the process data of the processing unit. SOLUTION: The process data obtained when the processing unit 31 performs deposition and inspection data obtained when an inspection device 41 inspects the film formed by means of the unit 31 for its state are acquired. From the process data and inspection data, the corrected value of the process data required to enable the unit 31 to properly perform deposition is found. The found corrected value of the process data is fed back to the unit 31 to cause the unit 31 to perform the deposition based on the corrected value. Consequently, the process data of the processing unit 31 can be corrected automatically and reasonably and the unit 31 can perform proper deposition.
申请公布号 JP2002184705(A) 申请公布日期 2002.06.28
申请号 JP20000383685 申请日期 2000.12.18
申请人 TOSHIBA CORP;TOSHIBA ENG CO LTD 发明人 YAMADA TAKASHI;MURAKAMI TOYOHIRO
分类号 C23C16/52;H01L21/205;H01L21/66;(IPC1-7):H01L21/205 主分类号 C23C16/52
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