| 摘要 |
PROBLEM TO BE SOLVED: To provide a photoelecronic module which houses electronic circuits, photoreceptors, laser chips and laser control circuit, etc., in a single package, has high performance and is made thin. SOLUTION: An electronic circuit substrate, a receptor substrate which mounts laser chips and a laser control circuit substrate are arranged in the package longitudinal direction and some of input/output of the electronic circuits are connected with lead wires of the side of the laser control circuit substrate. |
